Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers at the Nepcon China Technology Summit on April 11, 2005 in Shanghai, China. 

 

The first paper is entitled, A Model Study of profiling for Voiding Control at Lead-Free Reflow Soldering. It contains detailed information regarding:

• Voiding mechanisms and their relation to flux outgassing
• Modeling of outgassing vs. heat input as a function of time and temperature
• Control of voiding via profiling

 

The second paper is entitled, The Transition to Pb-Free Production: From iNEMI Roadmap to Production. It includes detailed information on:

• Pb-Free Alloy selection assessment
• Pb-Free Manufacturability assessment
• Pb-Free Supply chain management

 

Dr. Lee is a world-renown soldering expert who has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

 

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium.  Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on Pb-Free soldering or Dr. Lee’s presentation, visit Indium Corporation at http://www.indium.com/ or email askus@indium.com.